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adilson.cardoso19@gmail.com

Upcoming Events

May 2018

IEEE ED/PHO Technical Presentation – Micro-Electronic Packaging: Glass Core Technology

May 25 @ 11:30 am - 1:00 pm

Micro-Electronic Packaging: Glass Core Technology and Through-Glass Vias -Glass Core Technology – What is it and why do we care? -Micro-Electronic Packaging – Quick background on Silicon substrates and packaging techniques. -Glass Core Applications and use cases – RF, Optics, Micro-Fluidics, etc. -Current Glass capabilities along with future hurdles. Speaker(s): Shane Dabrowski, Agenda: 11:30 AM - Lunch will be provided free of charge 12 PM - 12:45 PM - Technical Presentation 12:45 PM - 1 PM - Q&A Location: GTRI…

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