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IEEE ED/PHO Technical Presentation – Micro-Electronic Packaging: Glass Core Technology
May 25, 2018 @ 11:30 am - 1:00 pm
Micro-Electronic Packaging: Glass Core Technology and Through-Glass Vias
-Glass Core Technology – What is it and why do we care?
-Micro-Electronic Packaging – Quick background on Silicon substrates and packaging techniques.
-Glass Core Applications and use cases – RF, Optics, Micro-Fluidics, etc.
-Current Glass capabilities along with future hurdles.
Speaker(s): Shane Dabrowski,
11:30 AM – Lunch will be provided free of charge
12 PM – 12:45 PM – Technical Presentation
12:45 PM – 1 PM – Q&A
GTRI Conference Center
250 14th Street NW