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IEEE ED/PHO Technical Presentation – Micro-Electronic Packaging: Glass Core Technology

May 25 @ 11:30 am - 1:00 pm

Micro-Electronic Packaging: Glass Core Technology and Through-Glass Vias

-Glass Core Technology – What is it and why do we care?

-Micro-Electronic Packaging – Quick background on Silicon substrates and packaging techniques.

-Glass Core Applications and use cases – RF, Optics, Micro-Fluidics, etc.

-Current Glass capabilities along with future hurdles.

Speaker(s): Shane Dabrowski,

Agenda:

11:30 AM – Lunch will be provided free of charge

12 PM – 12:45 PM – Technical Presentation

12:45 PM – 1 PM – Q&A

Location:
GTRI Conference Center
250 14th Street NW
Atlanta, Georgia
30318

Details

Date:
May 25
Time:
11:30 am - 1:00 pm
Website:
http://meetings.vtools.ieee.org/m/172957